Ceramic Semiconductor Packages

Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition.

Ceramic semiconductor packages.

Dip packages came into volume production in early 70 s. However the simple construc. Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements. Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016.

Spectrum semiconductor materials extensive inventory of ceramic cerpac packages are available in 14 18 20 24 and 28 pin configurations. A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The first semiconductor package. This was the first real semiconductor package.

The body of the component is ceramic. High pin count semiconductor packaging. Miniature ceramic packages for crystal devices. Is a world wide authorized distributor of packages and lids for ic assembly.

Hermetic packages national semiconductor offers a wide variety of ceramic and metal can packages for through hole and surface mount ap plications. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Ceramic column grid array ccga. Three engineers from fairchild.

Ametek offers both glass to metal seal and ceramic to metal seal technology to its customers. Micro ball grid array μbga. Ball spacing less than 1 mm. A semiconductor package is a metal plastic glass or ceramic casing containing one or more discrete semiconductor devices or integrated circuits individual components are fabricated on semiconductor wafers commonly silicon before being diced into die tested and packaged the package provides a means for connecting it to the external environment such as printed circuit board via leads.

Located in silicon valley spectrum semiconductor materials inc. Don forbes rex rice and bryant rogers invented a 14 lead ceramic dual in line package dip with two rows of pins. The pressed ceramic packages are typically lower in cost than the multilayer packages. These ceramic and metal can packages are of.

Ultra small ceramic packages help miniaturize highly functional crystal devices which are essential in electronics. A package with metric pin distribution 0 5 mm pitch.